Photonic wire bonding using high refractive index UV curable resin for dip-in 3D laser lithography

Lixin Xiang, Sho Okada, Katsunori Nishiura, Takuo Shikama, Shu Nagamatsu, Towa Maekawa, Kensuke Otsuka, Tomohiro Amemiya, 第72回応用物理学会春季学術講演会, 15p-K305-14, Mar. 2025.