High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration

投稿日 : 2019年3月25日カテゴリー : タグ : 投稿者 : titech-amamiya-lab

T. Kikuchi, L. Bai, T. Mitarai, H. Yagi, T. Amemiya, N. Nishiyama, S. Arai, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), to be presented, May 2019.