Optical interconnection between III-V chips on Si by using photonic wire bonding

Z. Gu, T. Amemiya, A. Ishikawa, J. Kang, T. Hiratani, Y. Hayashi, J. Suzuki, N. Nishiyama, T. Tanaka, S. Arai, 4th International Symposium on Photonics and Electronics Convergence (ISPEC 2014), P-4, Nov. 2014.