Y. Hayashi, J. Suzuki, Y. Kuno, J. Kang, T. Amemiya, N. Nishiyama, S. Arai, 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014), Jul. 2014.
Y. Hayashi, J. Suzuki, Y. Kuno, J. Kang, T. Amemiya, N. Nishiyama, S. Arai, 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014), Jul. 2014.