論文
2025年
解説記事
執筆書籍
2025年
招待講演
2025年
国際会議
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Photonic wire bonding using world’s highest refractive index UV curable resin for dip-in 3D laser lithography
L. Xiang, S. Okada, K. Nishiura, T. Shikama, S. Nagamatsu, T. Maekawa, K. Otsuka, T. Amemiya, The 9th International Congress on Laser Advanced Materials Processing (LAMP 2025), 27-02, Jun. 2025.
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Fabrication of photonic wire bonding using a developed polymer with a refractive index of 1.65 for direct laser writing
S. Okada, K. Nishiura, T. Shikama, K. Otsuka, T. Amemiya, L. Xiang, N. Yamamoto, K. Akahane, The 9th International Congress on Laser Advanced Materials Processing (LAMP 2025), 39-05, Jun. 2025.