論文
2019年
特許
招待講演
2019年
国際会議
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Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform
T. Miyazaki, F. Tachibana, T. Kikuchi, T. Hiratani, H. Yagi, M. Eissa, T. Mitarai, T. Amemiya, N. Nishiyama, S. Arai, Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019), TuA3-6, May 2019.
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Buried-ridge-waveguide Type GaInAsP/InP Membrane Distributed-Reflector Lasers for Reduction of Differential Resistance
N. Takahashi, N. Nakamura, T. Yoshida, W. Fang, T. Amemiya, N. Nishiyama, S. Arai, Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019), MoP-D-11, May 2019.
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Investigation of InP/Si bonding condition for optimizing Photoluminescence property by Surface Activated Bonding based on Fast Atom Beam
Y. Wang, T. Mitarai, T. Amemiya, N. Nishiyama, S. Arai, Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019), MoP-D-14, May 2019.
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High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration
T. Kikuchi, L. Bai, T. Mitarai, H. Yagi, T. Amemiya, N. Nishiyama, S. Arai, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), to be presented, May 2019.